Two-dimensional materials for advanced back-end-of-line and wafer backside technologies
17 September 2026 at 08:00
Nature Nanotechnology, Published online: 17 September 2026; doi:10.1038/s41565-026-02274-2
Two-dimensional materials offer low resistivity, strong thermal management and back-end-of-line compatibility, making them promising for advanced interconnects, backside power delivery and boosting efficiency in next-generation semiconductor chips.