arXiv:2504.19959v4 Announce Type: cross Abstract: Verification presents a major bottleneck in Integrated Circuit (IC) development, consuming nearly 70% of the total development effort. While the Universal Verification Methodology (UVM) is widely used in industry to improve verification efficiency through structured and reusable testbenches, constructing these testbenches and generating sufficient stimuli remain challenging. These challenges arise from the considerable manual coding effort required, repetitive manual execution of multiple EDA tools, and the need for in-depth domain expertise to navigate complex designs.Here, we present UVM^2, an automated verification framework that leverages Large Language Models (LLMs) to generate UVM testbenches and iteratively refine them using coverage feedback, significantly reducing manual effort while maintaining rigorous verification standards.To evaluate UVM^2, we introduce a benchmark suite comprising Register Transfer Level (RTL) designs of up to 1.6K lines of code.The results show that UVM^2 reduces testbench setup time by up to UVM^2 compared to experienced engineers, and achieve average code and function coverage of 87.44% and 89.58%, outperforming state-of-the-art solutions by 20.96% and 23.51%, respectively.

arXiv:2503.12946v2 Announce Type: replace-cross Abstract: This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design.