Samsung has partnered with Mistral AI to deploy on-premises models across its semiconductor manufacturing and engineering operations.

The agreement was announced during the bilateral state summit held in Paris between South Korea and France. Samsung will integrate Mistral’s software suite – including its flagship Mistral Large model – into internal semiconductor facilities to build customised models for intelligence-driven factory infrastructure.

On-premises AI models for semiconductor fab infrastructure

The deployment relies on private enterprise installations to process sensitive engineering and operational records within Samsung’s computing perimeter. This architecture keeps proprietary technical data contained within company infrastructure, avoiding external cloud exposure while maintaining control over operational assets.

“Increasing complexities involved in AI chip design and manufacturing requires continuous innovation in semiconductor technologies,” says Young Hyun Jun, Vice Chairman and CEO of the Device Solutions (DS) Division at Samsung Electronics.

Mistral will provide Samsung with a specialised stack of software tools to assist in how processors are designed and produced.

“AI is reshaping how we build complex technologies, from silicon to software,” says Arthur Mensch, co-founder and CEO of Mistral.

“We are proud to support Samsung Electronics with our expertise in electronics and semiconductors, helping to improve how chips are designed and manufactured, and to accelerate technical progress across the global semiconductor and AI value chain.”

Defect detection and yield stabilisation

Samsung plans to deploy the targeted models directly to automated defect detection and fab machinery tuning. As semiconductor production processes advance, rapid data analysis inside the fab becomes necessary to maintain factory throughput.

The company expects targeted AI models to accelerate development cycles, improve manufacturing precision, and stabilise production yields across advanced memory and logic chips. The operational scope covers Samsung’s memory division, logic design units, and contract foundry business.

Samsung also led Mistral AI’s Series D funding round, securing a strategic equity stake to support long-term technical cooperation.

The lead investment expands cross-industry collaboration between silicon manufacturers and AI developers across advanced memory, logic, and foundry operations.

See also: Arm launches Total Design for Physical AI and robotics framework

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Arm has launched Arm Total Design for Physical AI alongside a new robotics framework to establish common standards across automated systems.

Physical industries – spanning mining, agriculture, manufacturing, and global transport – account for trillions of dollars in economic activity and an estimated $200 billion annual compute opportunity by the 2030s.

To address engineering fragmentation across these sectors, Arm is convening more than 80 partner organisations spanning software, hardware, and AI. Initial ecosystem participants include AWS, ECARX, Hugging Face, Liquid AI, NXP, PlusAI, PSYONIC, QNX, Qwen, Siemens, and Unitree Robotics.

The initiative targets physical systems that combine AI models, runtime software, compute silicon, sensors, and actuators to sense, reason, and act in operational environments. Hardware manufacturers and software developers require standardised baselines to reduce integration risk, optimise compute workloads, and move from proof-of-concept testing to deployment at scale.

Arm standardises capability tiers for robotics systems

Robotics currently lacks a common method to describe, compare, and communicate system capabilities, according to an architectural manifesto (PDF) published by Arm chief architect Richard Grisenthwaite. This fragmentation makes robotic systems harder to design, integrate, and scale across industrial deployments.

In response, Arm has introduced the Robotics Capability Framework as a collaborative starting point for a shared technical vocabulary, patterned after the SAE Levels used for driving automation.

Arm’s new framework categorises robotic systems across progressing tiers of operational sophistication, mapping machines from reactive setups to context-aware, cognitive, and self-improving systems.

Each capability tier links real-world use cases to machine behaviours, outputs, and hardware constraints. These criteria establish parameters for system latency, compute placement, memory allocation, power constraints, determinism, and safety standards.

Arm developed the initial baseline using feedback from across the robotics sector. Participating organisations contributing to the framework include Anaxi Labs, ANYbotics, FMC³ Robotics, Fourier, GALBOT, Gravis Robotics, Lenovo, McKinsey, and Robotec.ai.

Virtual platforms accelerate pre-silicon automotive physical AI development

Arm Total Design for Physical AI extends a collaborative development structure previously used for cloud AI infrastructure. The programme brings together AI models, virtual platforms, digital twins, sensors, compute silicon, and software stacks to enable earlier development and testing cycles.

Autonomous transport and robotics face common technical requirements across sensory perception, AI processing, real-time control, safety, and power-efficient compute. Arm demonstrated this collaborative methodology in the automotive sector alongside AWS, Google, HERE, RemotiveLabs, and Siemens.

The participating automotive companies developed an integrated digital cockpit reference solution. This environment enabled software engineering teams to develop, test, and validate complex automotive code on the Arm Zena CSS platform prior to physical silicon availability.

Arm is now soliciting technical contributions from the wider engineering community to expand the Robotics Capability Framework as physical AI implementations progress.

Learn more about physical AI during the Physical AI Expo held in Amsterdam, London, and North America.

See also: NVIDIA Jetson Orin Nano 2 brings physical AI to drones and robots

Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. The comprehensive event is part of TechEx and is co-located with other leading technology events including the Cyber Security & Cloud Expo. Click here for more information.

AI News is powered by TechForge Media. Explore other upcoming enterprise technology events and webinars here.

The post Arm launches Total Design for Physical AI and robotics framework appeared first on AI News.